A nanoclustered ceria abrasives with low crystallinity and high Ce3+/Ce4+ ratio for scratch reduction and high oxide removal rates in the chemical mechanical planarization

Na Yeon Kim, Goeun Kim, Hanna Sun, Uiseok Hwang, Junyoung Kim, Donggeon Kwak, In Kyung Park, Taesung Kim, Jonghwan Suhr, Jae Do Nam

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