In vitro burn model illustrating heat conduction patterns using compressed thermal papers

Jun Yong Lee, Sung No Jung, Ho Kwon

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

To date, heat conduction from heat sources to tissue has been estimated by complex mathematical modeling. In the present study, we developed an intuitive in vitro skin burn model that illustrates heat conduction patterns inside the skin. This was composed of tightly compressed thermal papers with compression frames. Heat flow through the model left a trace by changing the color of thermal papers. These were digitized and three-dimensionally reconstituted to reproduce the heat conduction patterns in the skin. For standardization, we validated K91HG-CE thermal paper using a printout test and bivariate correlation analysis. We measured the papers' physical properties and calculated the estimated depth of heat conduction using Fourier's equation. Through contact burns of 5, 10, 15, 20, and 30 seconds on porcine skin and our burn model using a heated brass comb, and comparing the burn wound and heat conduction trace, we validated our model. The heat conduction pattern correlation analysis (intraclass correlation coefficient: 0.846, p < 0.001) and the heat conduction depth correlation analysis (intraclass correlation coefficient: 0.93, p < 0.001) showed statistically significant high correlations between the porcine burn wound and our model. Our model showed good correlation with porcine skin burn injury and replicated its heat conduction patterns.

Original languageEnglish
Pages (from-to)124-131
Number of pages8
JournalWound Repair and Regeneration
Volume23
Issue number1
DOIs
StatePublished - 1 Jan 2015

Bibliographical note

Publisher Copyright:
© 2014 by the Wound Healing Society.

Fingerprint

Dive into the research topics of 'In vitro burn model illustrating heat conduction patterns using compressed thermal papers'. Together they form a unique fingerprint.

Cite this